Adhesion of polyimides to ceramics: Effects of aminopropyltriethoxysilane and temperature and humidity exposure on adhesion

By Buchwalter L.P.  

Journal of Adhesion Science and Technology, Vol. 5, Iss. 4, 1991-01 ,pp. : 333-343

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XPS analysis of fluorinated polyimides

By Buchwalter L.P.  

Journal of Adhesion Science and Technology, Vol. 10, Iss. 11, 1996-01 ,pp. : 1141-1152

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DFT calculations for a photoresist polymer/TaO substrate adhesion in wafer fabrication

By Wu Ping   Jin Hong Mei   Liu Hong Lin  

Journal of Adhesion Science and Technology, Vol. 17, Iss. 8, 2003-08 ,pp. : 1075-1081

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Use of high temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface modified by an AC nitrogen glow discharge

By Ma J.B.  

Journal of Adhesion Science and Technology, Vol. 9, Iss. 4, 1995-01 ,pp. : 487-499

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Surface and interface vibrational spectroscopy: relevance to adhesion

By Urban Marek W.  

Journal of Adhesion Science and Technology, Vol. 7, Iss. 1, 1993-01 ,pp. : 1-47

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