Modelling of transient heat conduction with diffuse interface methods

Author: Ettrich J   Choudhury A   Tschukin O   Schoof E   August A   Nestler B  

Publisher: IOP Publishing

ISSN: 0965-0393

Source: Modelling and Simulation in Materials Science and Engineering, Vol.22, Iss.8, 2014-12, pp. : 85006-85034

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