A Thermoresponsive and Magnetic Colloid for 3D Cell Expansion and Reconfiguration

Publisher: John Wiley & Sons Inc

E-ISSN: 1521-4095|27|4|662-668

ISSN: 0935-9648

Source: ADVANCED MATERIALS, Vol.27, Iss.4, 2015-01, pp. : 662-668

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Abstract