![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Publisher: John Wiley & Sons Inc
E-ISSN: 1862-6319|212|2|348-355
ISSN: 1862-6300
Source: PHYSICA STATUS SOLIDI (A) APPLICATIONS AND MATERIALS SCIENCE, Vol.212, Iss.2, 2015-02, pp. : 348-355
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Indium‐Free Fully Transparent Electronics Deposited Entirely by Atomic Layer Deposition
ADVANCED MATERIALS, Vol. 28, Iss. 35, 2016-09 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Optimized indium tin oxide contact for organic light emitting diode applications
By Zhu F. Zhang K. Guenther E. Jin C.S.
Thin Solid Films, Vol. 363, Iss. 1, 2000-03 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Indium-copper multilayer composites for fluxless oxidation-free bonding
Thin Solid Films, Vol. 283, Iss. 1, 1996-09 ,pp. :