Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Publisher： IOP Publishing

E-ISSN： 1878-5514|16|3|149-166

ISSN： 1468-6996

Source： Science and Technology of Advanced Materials, Vol.16, Iss.3, 2015-06, pp. : 149-166

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