Vacuum-based picking-up of thin chip from adhesive tape

Author： Xu Zhoulong   Liu Zunxu   Huang YongAn   Chen Jiankui   Liu Huimin   Yin Zhouping  

Publisher： Taylor & Francis Ltd

E-ISSN： 1568-5616|29|13|1315-1329

ISSN： 1568-5616

Source： Journal of Adhesion Science and Technology, Vol.29, Iss.13, 2015-07, pp. : 1315-1329

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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