Formation and Distribution of Sn-Cu IMC in Lead-Free Soldering Process Induced by Laser Heating

Publisher： Bentham Science Publishers

E-ISSN： 1876-4037|2|3|178-184

ISSN： 1876-4029

Source： Micro and Nanosystems, Vol.2, Iss.3, 2010-09, pp. : 178-184

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