The Process and Mechanism of Low Temperature Silicon Carbide-to-Silicon Direct Bonding Using Amorphous Hydrogenated Silicon Carbide Films

Publisher： Bentham Science Publishers

E-ISSN： 1876-4037|2|2|100-107

ISSN： 1876-4029

Source： Micro and Nanosystems, Vol.2, Iss.2, 2010-06, pp. : 100-107

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Gold metallizations for eutectic bonding of silicon wafers

By Lani S. Bosseboeuf A. Belier B. Clerc C. Gousset C. Aubert J.

Microsystem Technologies, Vol. 12, Iss. 10-11, 2006-09 ,pp. : 1021-1025

Springer Publishing Company

Access to resources Recommend Favorite

State control of passivating films in electrolytic in-process dressing precision grinding for silicon nitride

By Ren C.Z. Jin W.D.

International Journal of Computer Applications in Technology, Vol. 29, Iss. 2-4, 2007-09 ,pp. : 243-246

Inderscience Publishers

Access to resources Recommend Favorite

Simulation of silicon semiconductor devices by means of a direct Boltzmann-Poisson solver

By Ertler C. Schürrer F.

COMPEL: Int J for Computation and Maths. in Electrical and Electronic Eng., Vol. 25, Iss. 4, 2006-10 ,pp. : 979-994

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Fabrication and characterization of a passive silicon-based direct methanol fuel cell

By Esquivel J. Sabaté N. Santander J. Torres N. Cané C.

Microsystem Technologies, Vol. 14, Iss. 4-5, 2008-04 ,pp. : 535-541

Springer Publishing Company

Access to resources Recommend Favorite

Planar microreactor for biochemical application made from silicon and polymer films

By Utsumi Yuichi Hitaka Yusuke Matsui Katsuhiro Takeo Masahiro Negoro Seiji Ukita Yoshiaki

Microsystem Technologies, Vol. 13, Iss. 5-6, 2007-03 ,pp. : 425-429

Springer Publishing Company

Access to resources Recommend Favorite