Advancement in microstructure and mechanical properties of lanthanum-doped tin-silver-copper lead free solders by optimizing the lanthanum doping concentration

Publisher： Emerald Group Publishing Ltd

E-ISSN： 1758-6836|27|2|69-75

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.27, Iss.2, 2015-04, pp. : 69-75

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