The impact of porosity on the formation of manganese based copper diffusion barrier layers on low-κ dielectric materials

Author: McCoy A P   Bogan J   Walsh L   Byrne C   O’Connor R   Woicik J C   Hughes G  

Publisher: IOP Publishing

E-ISSN: 1361-6463|48|32|325102-325106

ISSN: 0022-3727

Source: Journal of Physics D: Applied Physics, Vol.48, Iss.32, 2015-08, pp. : 325102-325106

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Abstract