Combined analysis of chemical bonding in a CuII dimer using QTAIM, Voronoi tessellation and Hirshfeld surface approaches

Publisher： John Wiley & Sons Inc

E-ISSN： 2052-5206|71|5|543-554

ISSN： 2052-5192

Source： ACTA CRYSTALLOGRAPHICA SECTION B (ELECTRONIC), Vol.71, Iss.5, 2015-10, pp. : 543-554

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