Use of a Ni Interlayer to Improve the Thermal Cycling Reliability of Cu/Sapphire Bilayers

Publisher： John Wiley & Sons Inc

E-ISSN： 1744-7402|12|3|685-692

ISSN： 1546-542x

Source： INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY, Vol.12, Iss.3, 2015-05, pp. : 685-692

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