Assembly, Structures, and Properties of a Series of Metal‐Organic Coordination Polymers Derived from a Semi‐rigid Bis‐pyridyl‐bis‐amide Ligand

Publisher: John Wiley & Sons Inc

E-ISSN: 1521-3749|641|7|1274-1281

ISSN: 0044-2313

Source: ZAAC-JOURNAL OF INORGANIC AND GENERAL CHEMISTRY (ELECTRONIC), Vol.641, Iss.7, 2015-06, pp. : 1274-1281

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