Chapter
1 Modeling of micro- and nano-scale cutting
1.2 Modeling of microscale cutting
1.2.1 Minimum chip thickness and size effect
1.2.2 FEM modeling of microscale cutting
1.3 Modeling of nanoscale cutting
1.3.1 Model geometry and material microstructure
1.3.3 Boundary conditions and input parameters
1.3.4 Numerical integration and equilibration
2 Machining scale: workpiece grain size and surface integrity in micro end milling
2.2 Specific cutting energy
2.4 Workpiece microstructure scale
2.5.5 Microstructural damages
3 Micromachining technique based on the orbital motion of the diamond tip
3.2 Principle of micromachining using the orbital motion of the diamond tip
3.3 Micromachining setup and test of the stage’s trajectory
3.3.1 Establishment of the micromachining setup and the machining procedure
3.3.2 Test of the trajectory of the nanopiezo stage in the orbital motion
3.4 Micromachining mechanism using the orbital motion of the tip
3.4.1 Comparison of chip states with the conical and pyramidal tips
3.4.2 Difference between the micromilling process and this technique
3.4.3 Determination of the uncut chip thickness and the cutting rake angle
3.5 Formation mechanism and control methods of burrs
3.5.1 Burr formation during machining with the conical tip
3.5.2 Burr formation during machining with the pyramidal tip
3.5.3 Methods of formation of slight burrs
3.6 Effects of the processing parameters and fabrication of microstructures
3.6.1 Effects of the processing parameters on machining microchannels
3.6.2 Effect of the feed on machining microstructures
3.6.3 Fabrication of typical microstructures
3.7 Summary and future works
4 Microelectrical discharge machining of Ti-6Al-4V: implementation of innovative machining strategies
4.2 Principle of electrical discharge machining
4.3 Overview of micro-EDM
4.4 Differences between EDM and micro-EDM
4.5 System components of micro-EDM
4.5.3 Dielectric circulating unit
4.6 Micro-EDM process parameters
4.6.1 Electrical process parameters
4.6.1.2 Gap and discharge voltage
4.6.2 Nonelectrical process parameters
4.6.2.2 Workpiece materials
4.6.2.3 Dielectric fluids
4.6.3 Gap control and motion parameters
4.6.3.2 Electrode rotation
4.6.3.3 Tool geometry and shape
4.6.3.4 Workpiece and tool vibration
4.6.3.5 Types of dielectric flushing
4.6.3.6 Flushing pressure
4.7 Performance criteria in micro-EDM
4.7.1 Material removal rate
4.7.2 Electrode wear ratio
4.7.5 Diametral variance at entry and exit holes
4.8 Titanium alloys as advanced engineering materials
4.9 Literature review of micro-EDM of Ti-6Al-4V
4.10 Investigation of micro-EDM process employing innovative machining strategies
4.10.1 Changing the polarity of electrodes
4.10.1.1 Experimental method and conditions
4.10.1.2 Experimental results and analysis
4.10.2 Rotating the microtool electrode
4.10.2.1 Experimental method and conditions
4.10.2.2 Experimental results and analysis
4.10.3 Comparative study of using kerosene and deionized water dielectrics
4.10.3.1 Experimental method and conditions
4.10.3.2 Experimental results and analysis
4.10.4 Comparative study of mixing a boron carbide additive in dielectrics
4.10.4.1 Experimental method and conditions
4.10.4.2 Experimental results and analysis
5 Microelectrochemical machining: principle and capabilities
5.1 Fundamentals of microelectrochemical machining
5.1.1 Principle of electrochemical machining
5.1.2 Microelectrochemical machining using ultra-short pulsed current
5.1.3 Miniaturization of cathode tool
5.2 Variety of micro-ECM processes
5.2.1 Microelectrochemical drilling
5.2.2 Microelectrochemical milling
5.2.3 Through-mask microelectrochemical machining
5.2.4 Microwire electrochemical machining
5.2.5 Microelectrochemical jet machining
5.3 Hybrid processes associated with microelectrochemical machining
5.3.1 Laser-induced electrochemical jet machining
5.3.2 Abrasive enhanced electrochemical jet machining
5.3.3 Process combining EDM with ECM
6 Microchannel fabrication via direct laser writing
6.2 Important materials for MEMS and microfluidic devices
6.2.2 Semiconductors, composites, and specially developed materials
6.2.3 Glass and polymer-based materials
6.3 Lasers for microfabrication
6.3.1 Timescale based division
6.3.1.1 Continuous wave laser
6.3.1.2 Short pulse lasers
6.3.1.3 Ultrashort pulse lasers
6.3.2 Wavelength based division
6.3.2.1 Mid infrared lasers (mid IR)
6.3.2.2 Infrared lasers (IR lasers)
6.3.2.3 Ultraviolet lasers (UV lasers)
6.4 Material removal mechanisms
6.4.2 Cold ablation/photochemical ablation/photo ablation
6.5 Laser microprocessing of materials
6.5.1 Direct laser micromachining in open surroundings
6.5.1.1 Metals and alloys
6.5.1.2 Semiconductors, composites, and specially developed materials
6.5.1.3 Glass and polymers
6.5.2 Direct laser micromachining in different surrounding conditions
6.6 Challenges and future of laser processing
7 Underwater pulsed laser beam cutting with a case study
7.2 Laser as a machine tool
7.3 Laser material interaction
7.4.1 Process characteristics
7.4.2 Cut quality characteristics
7.4.3 Principles of laser beam cutting
7.4.3.1 Different types of laser beam cutting
7.4.3.1.1 Laser sublimation cutting
7.4.3.1.2 Controlled fracture technique
7.4.3.1.3 Laser fusion cutting
7.4.3.1.4 Reactive fusion cutting
7.4.3.1.5 Laser cutting at different assisted medium
7.4.3.1.6 Laser beam microcutting
7.4.4 Application of laser beam machining
7.5 Underwater laser beam machining
7.5.1 Advantages of laser beam cutting at submerged condition
7.5.2 Material removal mechanism of nanosecond pulsed laser beam cutting at submerged condition
7.5.3 Development of different types of liquid-assisted laser beam machining
7.5.3.1 Laser beam cutting in submerged condition
7.5.3.2 Underwater assist gas jet/waterjet assisted laser beam cutting
7.5.3.3 Molten salt-jet-guided/chemical laser beam
7.5.3.4 Water jet following the laser beam
7.5.3.5 Laser beam cutting of opaque material at partially submerged condition
7.5.3.6 Laser beam cutting of transparent material at partially submerged condition
7.5.3.7 Hybrid waterjet laser cutting
7.6 Pulsed IR laser ablation of Inconel 625 superalloy at submerged condition: A case study
7.6.2 Development of mathematical model
7.6.4 Effects of different process parameters on machining responses
7.6.4.1 Effect of different process parameters on kerf width
7.6.4.2 Effect of different process parameters on depth of cut
7.6.4.3 Effect of different process parameters on HAZ width
8 Glass molding process for microstructures
8.1 Application of microstructures
8.1.1 Optical imaging in an optical system
8.1.2 Positioning sensor in machine tools and measurement equipment
8.1.3 Micro fluid control in a biomedical field
8.2 Fundamental of glass molding technique
8.2.2 Materials suited for optical microstructures molding
8.2.2.1 Polymethyl methacrylate
8.2.2.2 Low-melting optical glass
8.2.2.3 Infrared Materials
8.2.3.1 Commonly used mold material
8.2.3.2 Mold machining method
8.2.3.3 New mold plating material
8.3 Modeling and simulation of microstructure molding
8.3.1 Modeling of viscoelastic constitutive
8.3.1.1 The Maxwell model
8.3.2 Simulation of microstructure molding process
8.3.3 GMP simulation coupling heat transfer and viscous deformation
8.3.3.1 Theoretical models of heat transfer and viscous deformation
Thermal expansion of glass
High-temperature viscosity of glass
Stress–strain relationship in viscous deformation
8.4 Glass molding process for microstructures
8.4.1 Glass molding machine
8.4.1.1 Glass molding machine PFLF7-60A
Adjustment of cylinder (see Fig. 8.38)
Cylinder 2–3 (heating 2–3)
Cylinders 5–6 (cooling 1–2)
Cooling water flow adjustment
8.4.1.2 Glass molding machine GMP211
8.4.2 Molding quality control
8.4.2.1 Temperature control
8.4.2.2 Mold oxidation prevention
8.4.2.3 Methods to increase mold life
Mold equipment diagnosis techniques
8.4.3.1 Incomplete filling
Microfabrication and Precision Engineering
：Research and Development
( Woodhead Publishing Reviews: Mechanical Engineering Series )
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