Effect of Aluminum Content on Mechanical Properties and Thermal Conductivities of Sintered Reaction-Bonded Silicon Nitride

Author： Kusano Dai Hyuga Hideki Zhou You Hirao Kiyoshi

Publisher： Blackwell Publishing

E-ISSN： 1744-7402|11|3|534-542

ISSN： 1546-542X

Source： International Journal of Applied Ceramic Technology, Vol.11, Iss.3, 2014-05, pp. : 534-542

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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