Simulation of the stresses produced in large-diameter silicon wafers during thermal annealing

Author： Mezhennyi M.   Mil’vidskii M.   Prostomolotov A.  

Publisher： MAIK Nauka/Interperiodica

ISSN： 1063-7834

Source： Physics of the Solid State, Vol.45, Iss.10, 2003-10, pp. : 1884-1889

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