Chapter
1.3.3 Test and measurement
2: Characteristics of liquid crystal polymer (LCP)
2.1.1 Liquid crystalline characteristics
2.1.2 Polymeric characteristics
2.2 Electrical characteristics
2.2.1 Dielectric and loss tangent characterization from DC to 60 GHz
2.2.2 Dielectric and loss tangent characterization from 30 to 110 GHz
2.2.3 Electrical characteristics over humidity
2.3 Physical characteristics
2.3.1 Dimensional stability
2.3.2 Adhesion strengths for package integrity
2.4.2 Permeability and leak-rate package testing
3: Fabrication techniques for processing LCP
3.1 Introduction to LCP material availability
3.1.1 Resin and pellet form
3.1.2 Unclad LCP laminate form
3.1.3 Copper-clad LCP laminate form
3.3 Standard PCB processing
3.3.1 PCB standard cleaning
3.3.2 PCB standard photolithography
3.3.3 PCB standard drilling and milling
Mechanical drilling and milling
Mechanical drilling and milling
3.3.4 PCB standard multilayer lamination
Heterogeneous material lamination
Homogeneous LCP lamination
Heterogeneous material lamination
Homogeneous LCP lamination
3.3.6 Roll-to-roll processing
3.4 Advanced LCP processes
Photoresist-based mounting technique
Photoresist-based mounting technique
3.4.2 Advanced LCP machining techniques
Mechanical stamping punch
Evaluation of machining for LCP packages
Mechanical stamping punch
Evaluation of machining for LCP packages
3.4.3 LCP air-cavity lid formation
Mechanically drilled air-cavity lid
Lid formed with combination laser and mechanical drilling
Mechanically drilled air-cavity lid
Lid formed with combination laser and mechanical drilling
Equipment developed for selective sealing
Demonstration prototypes of selective sealing process
Thermal analysis for selective sealing
Equipment developed for selective sealing
Demonstration prototypes of selective sealing process
Thermal analysis for selective sealing
3.4.5 Evaluating planarity after LCP lid sealing
3.4.6 LCP molding techniques
4: LCP for wafer-level chip-scale MEMS
4.1 Wafer-level chip-scale packaging of an RF MEMS switch
4.1.1 Packaging steps for LCP-encapsulated RF MEMS
4.1.2 Package electrical design
4.1.3 Package electrical measurements
4.2 Hybrid phase shifter on multilayer organic multi-chip module
4.2.1 Description of processes
4.2.2 Design of a multi-chip module MEMS phase shifter
Design of true-time delay lines
Fully composed phase shifter
Design of true-time delay lines
Fully composed phase shifter
4.2.3 Packaged phase shifter measurements
5: LCP for surface mount interconnects, packages, and modules
5.1 Design process for a thin-film LCP surface mount package and feed-through
Package feed-through design overview
5.1.2 Microstrip line to bond wire transition
5.1.3 Grounded coplanar waveguide (CPWG) below package base
5.1.4 Coplanar waveguide probe launch on test board
5.1.5 Electrical performance sensitivity of package trace thickness
5.1.7 Fabrication of LCP package base
5.1.8 Feed-through measurement and model extraction
5.1.9 Insertion loss roll-off beyond 40 GHz
5.1.10 Package isolation measurement
5.1.11 Measurement and simulation of packaged amplifier
5.2 DC blocked coupled-line interconnect
5.2.1 Coupled-line interconnect design
Material thickness sensitivity
Material thickness sensitivity
5.2.2 Coupled-line interconnect fabrication and measurement results
5.3 DC blocked lumped-element coupled interconnect
5.3.1 Lumped-element interconnect design
5.3.2 Lumped-element interconnect sensitivity analysis
Lateral-offset sensitivity
Coupling-layer-thickness sensitivity
Lateral-offset sensitivity
Coupling-layer-thickness sensitivity
5.3.3 Lumped-element interconnect measurement results
5.4 Ka-band down-converter multi-chip module (MCM) using LCP SMT packages
5.4.1 Schematic diagram, chip components, and cross-section of module
5.4.2 Design and simulation of signal traces
Package base microstrip line to chip pad bond wire transition
Stripline design for IF output from mixer
Down-converter package prototypes
Package base microstrip line to chip pad bond wire transition
Stripline design for IF output from mixer
Down-converter package prototypes
5.4.3 Assembly and measurements of Ka-band down-converter module
Initial LNA gain measurement
Conversion gain measurement
Loss analysis of down-converter module
Initial LNA gain measurement
Conversion gain measurement
Loss analysis of down-converter module
6: LCP for passive components
6.1 Broadband LCP Marchand balun
6.1.3 Design and simulation of an LCP balun
6.1.4 Electrical measurements on an LCP balun
Measured Marchand balun with even-mode matching
Measured Marchand balun with even-mode matching
6.1.5 Defected ground structure balun
6.2 Wilkinson power combiner section
6.2.1 Background and design
6.2.3 LCP Wilkinson summary
6.3 Folded broadband LCP hybrid coupler
6.3.2 Measurement results
6.3.3 Hybrid coupler summary
7.1 Wideband thin-film amplitude-compensated LTD circuits implementing MEMS switches
7.1.2 Fabrication and measurement results
7.2 Broadband push–pull PA
7.2.1 Push–pull PA design and fabrication
7.2.2 Push–pull PA module measurement without EMMN
Harmonic distortion measurement
Intermodulation distortion measurement
Harmonic distortion measurement
Intermodulation distortion measurement
7.2.3 Measurement results for a push–pull PA with EMMN
7.2.4 Push–pull PA enabled by LCP summary
7.3 Receiver module with phased-array antenna
7.3.1 Overview of phased-array technology
7.3.3 Passive antenna array design
7.3.5 Phased-array antenna receiver module conclusions
8.1 Package vehicle for environmental testing
8.2.2 Non-operating rapid thermal transition
8.2.3 Non-operating high-temperature storage
8.2.4 Non-operating thermal shock
8.3 Moisture and temperature stressing
8.3.1 Operating humidity exposure (85.°C/85%)
8.3.2 Non-operating moisture resistance
8.3.3 Freeze–expansion stressing
8.4.1 Non-operating mechanical shock
8.4.2 Non-operating vibration
Abbreviations, acronyms, and symbols
LCP for Microwave Packages and Modules
( The Cambridge RF and Microwave Engineering Series )
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