The effect of waveform for pulse plating on copper plating distribution of microvia in PCB manufacture

Author: Yung K.   Chan K.   Yue T.   Yeung K.  

Publisher: Springer Publishing Company

ISSN: 0268-3768

Source: The International Journal of Advanced Manufacturing Technology, Vol.23, Iss.3-4, 2004-02, pp. : 245-248

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