Construction of 3D solder paste surfaces using multi-projection images

Author: Kuo Chung-Hsien   Yang Fang-Chung   Wing Jein-Jong   Yang Ching-Kun  

Publisher: Springer Publishing Company

ISSN: 0268-3768

Source: The International Journal of Advanced Manufacturing Technology, Vol.31, Iss.5-6, 2006-12, pp. : 509-519

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