Numerical analysis of stress distribution in Cu-stabilized GdBCO CC tapes during anvil tests for the evaluation of transverse delamination strength

Author: Dizon John Ryan C   Gorospe Alking B   Shin Hyung-Seop  

Publisher: IOP Publishing

ISSN: 0953-2048

Source: Superconductor Science and Technology, Vol.27, Iss.5, 2014-05, pp. : 55023-55030

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