Using self-assembled monolayers for controlled electrodeposition of copper into submicrometer size surface features/decrements

Author: Donten Mikołaj   Donten Mateusz   Stojek Zbigniew   Wikiel Kazimierz  

Publisher: Springer Publishing Company

ISSN: 1432-8488

Source: Journal of Solid State Electrochemistry, Vol.10, Iss.5, 2006-05, pp. : 288-292

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