Chemical emissions from adhesive-bonded wood products at elevated temperatures

Author： Peng Yucheng   Shi Sheldon   Ingram Leonard  

Publisher： Springer Publishing Company

ISSN： 0043-7719

Source： Wood Science and Technology, Vol.45, Iss.4, 2011-11, pp. : 627-644

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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