Related content

Electromigration in a Sn-3 wt.%Ag-0.5 wt.%Cu-3 wt.%Bi Solder Stripe Between Two Cu Electrodes Under Current Stressing

By Lee Shang-Hua  

Journal of Electronic Materials, Vol. 40, Iss. 9, 2011-09 ,pp. : 1943-1949

Springer Publishing Company

Access to resources Recommend Favorite

Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps

By Kim Jae-Myeong  

Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 791-799

Springer Publishing Company

Access to resources Recommend Favorite

Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects

By Huang M.  

Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 730-740

Springer Publishing Company

Access to resources Recommend Favorite

Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

By Lee Tae-Kyu  

Journal of Electronic Materials, Vol. 40, Iss. 9, 2011-09 ,pp. : 1895-1902

Springer Publishing Company

Access to resources Recommend Favorite

Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique

By Ma Limin  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 425-430

Springer Publishing Company

Access to resources Recommend Favorite