Characterization of the auto‐curing behavior of rapid prototyping materials for three‐dimensional printing using dielectric analysis

Publisher： John Wiley & Sons Inc

E-ISSN： 1548-2634|55|7|1485-1493

ISSN： 0032-3888

Source： POLYMER ENGINEERING & SCIENCE, Vol.55, Iss.7, 2015-07, pp. : 1485-1493

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