Laser Printing of Functional Materials :3D Microfabrication, Electronics and Biomedicine

Publication subTitle :3D Microfabrication, Electronics and Biomedicine

Author: Alberto Piqué; Pere Serra  

Publisher: Wiley‎

Publication year: 2018

E-ISBN: 9783527805136

P-ISBN(Hardback):  9783527342129

Subject: TN249 laser application

Keyword: 工程材料学

Language: ENG

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Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Description

The first book on this hot topic includes such major research areas as printed electronics, sensors, biomaterials and 3D cell printing.
Well-structured and with a strong focus on applications, the text is divided in three sections with the first describing the fundamentals of laser transfer. The second provides an overview of the wide variety of materials that can be used for laser transfer processing, while the final section comprehensively discusses a number of practical uses, including printing of electronic materials, printing of 3D structures as well as large-area, high-throughput applications. The whole is rounded off by a look at the future for laser printed materials.
Invaluable reading for a broad audience ranging from material developers to mechanical engineers, from academic researchers to industrial developers and for those interested in the development of micro-scale additive manufacturing techniques.

Chapter

Acknowledgments

References

Chapter 2 Origins of Laser‐Induced Transfer Processes

2.1 Introduction

2.2 Early Work in Laser‐Induced Transfer

2.3 Overview of Laser‐Induced Forward Transfer

2.3.1 Transferring Metals and Other Materials with Laser‐Induced Forward Transfer (LIFT)

2.3.2 Limitations of the Basic LIFT Technique

2.3.3 The Role of the Donor Substrate

2.3.4 Use of a Dynamic Release Layer (DRL)‐LIFT

2.3.5 LIFT with Ultrashort Laser Pulses

2.4 Other Laser‐Based Transfer Techniques Inspired by LIFT

2.4.1 Matrix‐Assisted Pulsed Laser Evaporation‐Direct Write (MAPLE‐DW) Technique

2.4.2 LIFT of Composite Matrix‐Based Materials

2.4.3 Hydrogen‐Assisted LIFT

2.4.4 Long‐Pulsed LIFT

2.4.5 Laser Molecular Implantation

2.4.6 Laser‐Induced Thermal Imaging

2.5 Other Studies on LIFT

2.6 Conclusions

References

Chapter 3 LIFT Using a Dynamic Release Layer

3.1 Introduction

3.2 Absorbing Release Layer – Triazene Polymer

3.3 Front‐ and Backside Ablation of the Triazene Polymer

3.4 Examples of Materials Transferred by TP‐LIFT

3.5 First Demonstration of Devices: OLEDs and Sensors

3.5.1 Organic Light Emitting Diode (OLEDs)

3.5.2 Sensors

3.6 Variation of the DRL Approach: Reactive LIFT

3.7 Conclusions and Perspectives

Acknowledgments

Conflict of Interest

References

Chapter 4 Laser‐Induced Forward Transfer of Fluids

4.1 Introduction to the LIFT of Fluids

4.1.1 Origin

4.1.2 Principle of Operation

4.1.3 Developments

4.2 Mechanisms of Fluid Ejection and Deposition

4.2.1 Jet Formation

4.2.2 Droplet Deposition

4.3 Printing Droplets through LIFT

4.3.1 Role of the Laser Parameters

4.3.2 Role of the Fluid Properties

4.3.3 Setup Parameters

4.4 Printing Lines and Patterns with LIFT

4.5 Summary

Acknowledgments

References

Chapter 5 Advances in Blister‐Actuated Laser‐Induced Forward Transfer (BA‐LIFT)

5.1 Introduction

5.2 BA‐LIFT Basics

5.3 Why BA‐LIFT?

5.4 Blister Formation

5.4.1 Dynamics of Blister Formation

5.4.2 Finite Element Modeling of Blister Formation

5.5 Jet Formation and Expansion

5.5.1 Computational Fluid Dynamics Model

5.5.2 Effect of the Laser Energy

5.5.3 Effect of the Ink Film Properties

5.6 Application to the Transfer of Delicate Materials

5.7 Conclusions

References

Chapter 6 Film‐Free LIFT (FF‐LIFT)

6.1 Introduction

6.2 Rheological Considerations in Traditional LIFT of Liquids

6.2.1 The Challenges behind the Preparation of a Thin Liquid Film

6.2.1.1 The Role of Spontaneous Instabilities

6.2.1.2 The Role of External Instabilities

6.2.2 Technologies for Thin‐Film Preparation

6.2.3 Wetting of the Receiver Substrate

6.3 Fundamentals of Film‐Free LIFT

6.3.1 Cavitation‐Induced Phenomena for Printing

6.3.2 Jet Formation in Film‐Free LIFT

6.3.3 Differences with LIFT of Liquids

6.4 Implementation and Optical Considerations

6.4.1 Laser Source

6.4.2 Forward (Inverted) versus Backward (Upright) Systems

6.4.3 Spherical Aberration and Chromatic Dispersion

6.5 Applications

6.5.1 Film‐Free LIFT for Printing Biomaterials

6.5.2 Film‐Free LIFT for Micro‐Optical Element Fabrication

6.6 Conclusions and Future Outlook

References

Part II The Role of the Laser–Material Interaction in LIFT

Chapter 7 Laser‐Induced Forward Transfer of Metals

7.1 Introduction, Background, and Overview

7.2 Modeling, Simulation, and Experimental Studies of the Transfer Process

7.2.1 Thermal Processes: Film Heating, Removal, Transfer, and Deposition

7.2.2 Parametric Effects

7.2.2.1 Laser Fluence and Film Thickness

7.2.2.2 Donor‐Film Gap Spacing

7.2.2.3 Pulse Width

7.2.3 Droplet‐Mode Deposition

7.2.4 Characterization of Deposited Structures: Adhesion, Composition, and Electrical Resistivity

7.3 Advanced Modeling of LIFT

7.4 Research Needs and Future Directions

7.5 Conclusions

References

Chapter 8 LIFT of Solid Films (Ceramics and Polymers)

8.1 Introduction

8.2 Assisted Release Processes

8.2.1 Optimization of LIFT Transfer of Ceramics via Laser Pulse Interference

8.2.1.1 Standing‐Wave Interference from Multiple Layers

8.2.1.2 Ballistic Laser‐Assisted Solid Transfer (BLAST)

8.2.2 LIFT Printing of Premachined Ceramic Microdisks

8.2.3 Spatial Beam Shaping for Patterned LIFT of Polymer Films

8.3 Shadowgraphy Studies and Assisted Capture

8.3.1 Shadowgraphic Studies of the Transfer of Ceramic Thin Films

8.3.2 Application of Polymers as Compliant Receivers

8.4 Applications in Energy Harvesting

8.4.1 LIFT of Chalcogenide Thin Films

8.4.2 Fabrication of a Thermoelectric Generator on a Polymer‐Coated Substrate

8.5 Laser‐Induced Backward Transfer (LIBT) of Nanoimprinted Polymer

8.5.1 Unstructured Carrier Substrate

8.5.2 Structured Carrier Substrate

8.6 Conclusions

Acknowledgments

References

Chapter 9 Laser‐Induced Forward Transfer of Soft Materials

9.1 Introduction

9.2 Background

9.3 Jetting Dynamics during Laser Printing of Soft Materials

9.3.1 Jet Formation Dynamics during Laser Printing of Newtonian Glycerol Solutions

9.3.1.1 Typical Jetting Regimes

9.3.1.2 Jetting Regime as Function of Fluid Properties and Laser Fluence

9.3.1.3 Jettability Phase Diagram

9.3.2 Jet Formation Dynamics during Laser Printing of Viscoelastic Alginate Solutions

9.3.2.1 Ink Coating Preparation and Design of Experiments

9.3.2.2 Typical Jetting Regimes

9.3.2.3 General Observation of the Jetting Dynamics

9.3.2.4 Effects of Laser Fluence on Jetting Dynamics

9.3.2.5 Effects of Alginate Concentration on Jetting Dynamics

9.3.2.6 Jettability Phase Diagram

9.4 Laser Printing Applications Using Optimized Printing Conditions

9.5 Conclusions and Future Work

Acknowledgments

References

Chapter 10 Congruent LIFT with High‐Viscosity Nanopastes

10.1 Introduction

10.2 Congruent LIFT (or LDT)

10.3 Applications

10.4 Achieving Congruent Laser Transfers

10.5 Issues and Challenges

10.6 Summary

Acknowledgment

References

Chapter 11 Laser Printing of Nanoparticles

11.1 Introduction, Setup, and Motivation

11.2 Laser‐Induced Transfer

11.3 Materials for Laser Printing of Nanoparticles

11.4 Laser Printing from Bulk‐Silicon and Silicon Films

11.5 Magnetic Resonances of Silicon Particles

11.6 Laser Printing from Prestructured Films

11.7 Applications: Sensing, Metasurfaces, and Additive Manufacturing

11.8 Outlook

References

Part III Applications

Chapter 12 Laser Printing of Electronic Materials

12.1 Introduction and Context

12.2 Organic Thin‐Film Transistor

12.2.1 Operation and Characteristics of OTFTs

12.2.2 Laser Printing of the Semiconductor Layer

12.2.3 Laser Printing of Dielectric Layers

12.2.4 Laser Printing of Conducting Layers

12.2.5 Single‐Step Printing of Full OTFT Device

12.3 Organic Light‐Emitting Diode

12.4 Passive Components

12.5 Interconnection and Heterogeneous Integration

12.6 Conclusion

References

Chapter 13 Laser Printing of Chemical and Biological Sensors

13.1 Introduction

13.2 Conventional Printing Methods for the Fabrication of Chemical and Biological Sensors

13.2.1 Contact Printing Methods

13.2.1.1 Pin Printing Approach

13.2.1.2 Microcontact Printing (or Microstamping) Technique

13.2.1.3 Nanotip Printing

13.2.2 Noncontact Printing Methods

13.2.2.1 Photochemistry‐Based Printing

13.2.2.2 Inkjet Printing Technique

13.2.2.3 Electrospray Deposition (ESD)

13.3 Laser‐Based Printing Techniques: Introduction

13.3.1 Laser‐Induced Forward Transfer

13.3.2 LIFT of Liquid Films

13.4 Applications of Direct Laser Printing

13.4.1 Biosensors

13.4.1.1 Background

13.4.1.2 Printing of Biological Materials for Biosensors

13.4.2 Chemical Sensors

13.5 Conclusions

References

Chapter 14 Laser Printing of Proteins and Biomaterials

14.1 Introduction

14.2 LIFT of DNA in Solid and Liquid Phase

14.3 LIFT of Biomolecules

14.3.1 Streptavidin and Avidin–Biotin Complex

14.3.2 Amyloid Peptides

14.3.3 Odorant‐Binding Proteins

14.3.4 Liposomes

14.4 Conclusions and Perspectives

Acknowledgments

Conflict of Interest

References

Chapter 15 Laser‐Assisted Bioprinting of Cells for Tissue Engineering

15.1 Laser‐Assisted Bioprinting of Cells

15.1.1 The History of Cell Bioprinting and Advantages of Laser‐Assisted Bioprinting for Tissue Engineering

15.1.2 Technical Specifications of Laser‐Assisted Bioprinting of Cells

15.1.3 Effect of Laser Process and Printing Parameters on Cell Behavior

15.2 Laser‐Assisted Bioprinting for Cell Biology Studies

15.2.1 Study of Cell–Cell and Cell–Microenvironment Interactions

15.2.2 Cancer Research

15.3 Laser‐Assisted Bioprinting for Tissue‐Engineering Applications

15.3.1 Skin

15.3.2 Blood Vessels

15.3.3 Heart

15.3.4 Bone

15.3.5 Nervous System

15.4 Conclusion

References

Chapter 16 Industrial, Large‐Area, and High‐Throughput LIFT/LIBT Digital Printing

16.1 Introduction

16.1.1 State of the Art in Digital Printing

16.1.2 History of Lasersonic® LIFT

16.2 Potential Markets and their Technical Demands on Lasersonic® LIFT

16.2.1 Digital Printing Market Expectations and Challenges

16.2.2 Demands on a LIFT/LIBT Printing Unit for Special Printing Markets

16.3 Lasersonic® LIFT/LIBT Printing Method

16.3.1 LIFT for Absorbing and LIBT for Transparent Inks

16.4 Optical Concept and Pulse Control of the Lasersonic® Printing Machine

16.4.1 Ultrafast Pulse Modulation at High Power Level

16.4.2 Time Schemes

16.4.3 Data Flow

16.4.4 Ultrafast Scan of the Laser Beam

16.5 The Four‐Color Lasersonic® Printing Machine

16.5.1 Large‐Area, High‐Throughput LIFT/LIBT Inline R2R Printing System

16.5.2 Printing Heads for Absorptive (Black) and for Transparent (Colored) Inks

16.5.3 Inking Units

16.5.4 Synthetic Approaches to the Absorption Layer of the LIBT Donor Surface

16.6 Print Experiments and Results

16.7 Discussion of Effects

16.7.1 LIFT Process with Continuous‐Wave Laser Source and Fast Modulation

16.7.2 Special Test Pattern to Study the Transfer Behavior at High Pixel Rate

16.8 Future Directions

16.9 Summary

Acknowledgments

References

Chapter 17 LIFT of 3D Metal Structures

17.1 Introduction

17.2 Basic Aspects of LIFT of Metals for 3D Structures

17.2.1 Ejection Regimes of Pure Metal Picosecond LIFT

17.2.1.1 Velocity of the Ejected Donor Material

17.2.1.2 Origin of Fragments in Cap‐Ejection Regime

17.2.2 Droplet Impact and Solidification

17.3 Properties of LIFT‐Printed Freestanding Metal Pillars

17.3.1 Reproducibility

17.3.2 Metallurgical Microstructure

17.3.3 Mechanical Properties

17.3.4 Electrical Properties

17.3.5 Inclined Pillars

17.4 Demonstrators and Potential Applications

17.5 Conclusions and Outlook

References

Chapter 18 Laser Transfer of Entire Structures and Functional Devices

18.1 Introduction

18.2 Early Demonstrations of LIFT of Entire Structures

18.3 Process Dynamics

18.3.1 Lase‐and‐Place

18.4 Laser Transfer of Intact Structures

18.4.1 Laser Transfer of Metal Foils for Electrical Interconnects

18.5 Laser Transfer of Components for Embedded Electronics

18.6 Outlook

18.7 Summary

Acknowledgments

References

Index

EULA

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