Advances in Abrasive Technology XI

Committees

Sponsors

Table of Contents

I. Grinding Mechanism

Prediction of Grinding Force Distribution in Wheel and Workpiece Contact Zone

Study on the Subsurface Damage of Single Crystal MgO Substrates

Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer

Comparative Study on the Materials Removal Mechanism of Ceramics and Steels

Grinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive Clusters

Experimental Analysis of Elastic and Plastic Behavior in Ductile-Regime Machining of Glass Quartz Utilizing a Diamond Tool

Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers

Fractal Analysis of Self-Sharpening Phenomenon in cBN Grinding

Observation of Abrasive Grains Behavior in Contact Area of Grinding Wheel and Comparison with Grinding Wheel Model

II. Grinding Systems and Tools

Thermal Damage of Micro Diameter Hole Drilled by Super-High-Speed Spindle in PWB

Experimental Trial of Fullerene Wheel Fabrication

Research of Ultrahigh Speed Grinding Spindle System Based on Squeeze Film Damping Technology

Development of CNT-Coated Diamond Grains Using Self-Assembly Techniques for Improving Electroplated Diamond Tools

Proposal of Pulverization Method Based on Grinding Process in Order to Recycle FRP Waste

III. Measurement and Modeling

Error Analysis and Robust Position Measurement for Vertex of a Small Polyhedron

Grinding Burn and Chatter Classification Using Genetic Programming

Control of Nano-Topography on an Axisymmetric Ground Surface

Measurement of High-NA Axisymmetric Aspherical Surface with Continuous Interference Method

Observation of Grinding Wheel Wear Patterns by Means of a 3-Dimensional Digital Measuring Method

Numerical Analysis for Thermal Deformation of Workpiece in Cylindrical Plunge Grinding

Fuzzy Rules for Surface Roughness of Ground Steels

Geometrical Simulation of Surface Finish Improvement in Helical Scan Grinding Method by Means of 3D-CAD Model

IV. Cutting

Planing of Cobalt-Free Tungsten Carbide Using a Diamond Tool -Cutting Temperature and Tool Wear-

Cutting Temperature Measurement in Turning with Actively Driven Rotary Tool

Coolant Effects on Tool Wear in Machining Single-Crystal Silicon with Diamond Tools

Machinability Investigation of Reaction-Bonded Silicon Carbide by Single-Point Diamond Turning

High Speed Cutting of Titanium Alloy with PCD Tools

Development of DLC Coated Tool for Cutting of Aluminum Alloy －Influence of Deposition Condition on Cutting Characteristic－

Observations on Orthogonal Cutting Processes - Effect of Friction between Tool and Work Material -

Development of A New Cutting Fluid Supply System for Near Dry Machining Process

V. Field-Assisted Machining

Study on the Surface Quality of Optical Glass in Ultrasonic-Magnetorheological Compound Finishing

Quartz Wafer Machining Using MCF (Magnetic Compound Fluid) Polishing Liquid Frozen with Liquid Nitrogen

Simulation and Experimental Analysis of Electromagnetic Inductor for Magnetic Abrasive Finishing

The Research of NC Magnetic Abrasive Finishing for Mould Parting Surface

VI. New Grinding Processes

Computer Aided Design and Grinding for Helical Drill Points

A New CBN Crystal for Improved Grinding Performance in Vitrified Bonds

Study on Two Kinds of Grinding Wheels for Dynamic Friction Polishing of CVD Diamond Film

Fundamental Study on the Precision Abrasive Machining Using a Cavitation in Reversing Suction Flow

Researches on Effect of Impact Micro-Damages in Contact Layer on Machinability in Quick-Point Grinding

Study on Abrasive Geometry of Quick-Point Grinding

Model-Based Compensation of Geometry-Errors when Grinding Material Compounds

A New Type of Drill Grinder Based on the Special Universal Joint

Simulation of Dynamic Performance for Hydro-Hybrid Spindle-Bearing System of Superhigh Speed Grinder

Model Based Characterization of the Grinding Wheel Effective Topography

VII. Vibration-Assisted Machining

Fabrication of High-Aspect Ratio Micro Holes on Hard Brittle Materials -Study on Electrorheological Fluid-Assisted Micro Ultrasonic Machining-

Grinding of Soft Steel with Assistance of Ultrasonic Vibrations

Ultrasonic Vibration-Assisted Cutting of Titanium Alloy

Effects of Grain Size and Concentration of Grinding Wheel in Ultrasonically Assisted Grinding

Electrochemical Finishing with an Electrode Vibrated with Biaxial Ultrasonic Transducer

Synchronous Finish Processes Using Grinding and Ultrasonic Electrochemical Finishing on Hole-Wall Surface

Development of a Three-Dimensional Tool Oscillation System for Finishing Metal Molds

VIII. Fluids for Machining

Engineering a Next Generation Water-Based Grinding Fluid

Evaluation of Bearing Grinding Fluids

The Correlation and Spectrum Research on Cylindrical Surface Lapping Machined with Abrasive Jet Finishing Restricted by Grinding Wheel

Application of a Floating Nozzle to Grinding Process Using an Edge of Grinding Wheel

A Study on Airflow Field of Super-High Speed Pectination Grinding Wheel Based on PIV

Actively Cooled and Activated Coolant for Grinding Brittle Materials

Spatial Distribution of Cooling Mist for Precision Grinding

IX. Truing and Dressing

A Truing Technique of Flattening Diamond Grains for Fabricating Microstructures with Fine Surfaces

The Possibility of Dressless Restoration of Grindactivity in Dry Grinding of Carbon

Virtual Truing and Dressing of Grinding Wheel

Effects of Cutting Edge Truncation on Ultrasonically Assisted Grinding

X. Abrasive Jet Machining

A Preliminary Study of the Erosion Process in Micro-Machining of Glasses with a Low Pressure Slurry Jet

Hole Machining of Glass by Micro Abrasive Suspension Jets

Simulation and Analysis of Abrasive Jet Machining with Wheel Restriction in Grinding

Profit Optimization of Abrasive Blasting Systems

Design of Double Nozzle Type Powder Jet Device Optimized for PJD

XI. Non-Conventional Machining

Grinding Combination of Electrochemical Smoothing On SKH 51 Surface

Fundamental Study on Influence of Surface Topography on Photocatalytic Reaction

Fundamental Research on Generation of Nanostructure by Means of Local Anodic Oxidation

An Investigation into Surface Roughness of EDM Using Soft Particles Suspension in Silicone Oil

XII. Slicing and Edge Processing

Analysis on the Fracture Failure of Brazed Diamonds in Wire Sawing

Effects of Thermal Deformation of Multi-Wire Saw’s Wire Guides and Ingot on Slicing Accuracy

Study on Glass Strength at High Speed Edge Rounding for LCD

XIII. CMP and Semiconductor Processing

The Deformation Mechanism at Pop-In: Monocrystalline Silicon under Nanoindentation with a Berkovich Indenter

Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)

Subsurface Structures of Monocrystalline Silicon Generated by Nanogrinding

Complete Recovery of Subsurface Structures of Machining-Damaged Single Crystalline Silicon by Nd:YAG Laser Irradiation

Study on Adhesion Removal Model in CMP SiO2 ILD

Study on the CMP Pad Life with its Mechanical Properties

Polishing Characteristics on Silicon Wafer Using Fixed Nano-Sized Abrasive Pad

A Study on Statistical Analysis of Si-Wafer Polishing Process for the Optimum Polishing Condition

Effect of Conditioning Parameters on Surface Non-Uniformity of Polishing Pad in Chemical Mechanical Planarization

Achieving a Damage-Free Polishing of Mono-Crystalline Silicon

Effect of Polishing Time and Pressure on Polishing Pad Performance

Polishing Characteristics of CMP for Oxygen Free Copper with Manganese Oxide Abrasives

Scale Effect of Nano-Indentation of Silicon – A Molecular Dynamics Investigation

Keywords Index

Authors Index