Engineered Materials

Author: Hampshire S.; Buggy M.; Carr A.J.  

Publisher: Trans Tech Publications‎

Publication year: 1993

E-ISBN: 9783035703436

P-ISBN(Paperback): 9780878496655

Subject: TB3 Engineering Materials

Keyword: 工程材料学

Language: ENG

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Description

Volume is indexed by Thomson Reuters CPCI-S (WoS).This book gives an impressive demonstration of the diversity and richness of contemporary materials science. The eigth conference of the Irish Materials Forum marks a decade in the span of a series of conferences, where state-of-the-art findings from researchers in Ireland, Europe and all over the world are reported to the younger generation of Irish engineers and materials specialists. It is hoped, that Engineered Materials has caught some of the spirit of this tradition.

Chapter

The Development of Methods for Assessing the Creep Crack Growth Behaviour of Materials in Elevated Temperature Hydrogen Service

Creep Deformation and Fracture Behaviour of Low Alloy Steel Weldments

Cryogenic Treatment of Three Heat-Treated Tool Steels

Material Requirements for Narrow Neck Press and Blow Plungers within the Glass Container Industry

The Unpredictable Behaviour of Aluminium and Some Stainless Steels in Certain Chemical Environments

The Bar Peeling of Nickel Based Alloys

Biaxial Flow and Fracture in a Metal Matrix Composite

Compaction Behaviour of Metal Matrix Composite

The Extrusion of Three Rapidly Solidified Powder Aloys Based on the Al-Mg-Li Ternary System

Finite Element Simulation and Experimental Investigation of Plane Strain Closed Die Forging

Mechanical Behaviour of Nylon at High Strain Rate and Room Temperature

Numerical Modelling of Heat Transfer during Overinjection of Thermoplastic Composite Materials

Development of a Shear Deformation Apparatus to Characterize the Interply Slip Mechanism of Advanced Thermoplastic Composites

Finite Element Analysis of a Thermoplastic Composite Sheet Forming Processes

Microstructure and Tensile Behaviour of a Long-Glass Fibre Reinforced Polyamide Component

Enhancing the Potencial of Polymeric Materials and Components for Reycling and Reclamation

Failure of Irradiated Polymers

Experimental Results for Polymer Coating of Fine Wires

Vacuum-Forming of Ceramic Fibre Furnace Modules

Fatigue Crack Growth in an Experimental Model of Femoral Fixation in the Artificial Hip Joint

Bone Structure and the Dynamics of Bone Adaptation in Response to Accumulative Damage

Structure Property Relationships in Glass Polyalkenoate Cements

Problems Associated with Experimental Accelerated Fatigue Testing of the Artificial Hip Joint

Micro-Scale and Nano-Scale Testing of Materials Using Scanned Probe Technologies

Surface Analysis of PVC/PMMA Blends

The Surface Analysis of Plasma Polymers Prepared from Saturated Precursors

Scanning Force Microscopy and Its Application to Engineered Materials

Development of a Digital Speckle Correlation System for Use in the Non-Destructive Testing of Advanced Engineering Ceramics

Indentation Induced Debonding of Magnetron Sputtered Silver Layers on Glass from Experimental and Finite Element Studies

Apatite-Mullite Glass-Ceramics

Sintering of Silicon Nitride Ceramics and Composites

Effect of Z-Value on Densification and Properties of Sialon-SiC Matrices and Composites

Development of a New Method for the R-Curve Determination of Ceramic Materials

Effects of Processing Variables on Microstructure Development of ZnO Ceramics for Varistor Applications

Influence of Heat Treatment, Dopant and Impurity Content on Creep Parameters of Superplastic Zirconia

A Critical Re-Evaluation of the Abrasive Wear of Brittle Solids

Simulation of Ion Beam-Induced Collisional Processes in Thin Film Titanium Silicide

Materials Engineering Aspects of Magneto-Optic Recording Materials

Preparation and Characterisation of Insulating Homogeneous Thick Films

Finite Element Thermal Modelling of the Laser Soldering Process

Visible and Infrared Optical Reflectance Spectroscopy of Silicon on Insulator Substrates

Investigation of the Influence of Gas Pressure on Dry-Etched Induced Damage on Semi-Insulating GaAs Substrates

Incoming Inspection of Silicon-on-Insulator Substrates Using Spectroscopic and Single Wavelength Ellipsometry

Acoustic Microscopy of Tape Automated Bonding (TAB) Tape for Interconnection and Packaging Applications

Materials Ireland-3RD Generation R & D Management

Keyword Index

Author Index

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