Plasma Properties, Deposition and Etching

Author: Pouch J.J.; Alterovitz S.A.  

Publisher: Trans Tech Publications‎

Publication year: 1993

E-ISBN: 9783035704808

P-ISBN(Paperback): 9780878496709

Subject: TB3 Engineering Materials

Keyword: 工程材料学

Language: ENG

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Description

Containing 42 invited papers, this fine book covers a broad range of subjects on plasmas and applications.In the first section, plasma properties and methods used to characterize the plasma are addressed. Many of these papers also cover deposition or etching of particular materials. The second part focuses on the application of various plasma techniques used to deposit thin films, and on the resulting film properties. Finally, the application of plasma etching to the fabrication of silicon-based circuits, plasma etching of III-V compound semiconductors and other processing applications are discussed in the third and last section. Plasma Properties, Deposition and Etching summarizes results obtained to date and is felt to provide a good basis for further development in the area.1. Plasma Properties and Diagnostics. 2. Plasma Deposition. 3. Plasma Etching and Processing.

Chapter

Modified ECR Plasma Deposition

DC Saddle-Field Plasma-Enhanced Vapour Deposition

Theoretical Characterization of Electron Energy Distribution Function in RF Plasmas

Ion Energy Distributions and Sidewall Profiles in Reactive Ion Etching

Dissipative Structures and Nonequilibrium Phenomena in Plasma-Surface Interaction

Source of Atomic Oxygen and its Application to Material Oxidation

Practical Applications of In-Situ Plasma-Etching Diagnostic Techniques

Laser-Aided Diagnostics of Processing Plasmas

Radical Kinetics in Processing Plasmas: Optical Diagnostics of Gas Phase and Surface Reactions

Negatively Charged Particles in Fluorocarbon RF Etch Plasmas: Density Measurements Using Microwave Resonance and the Photodetachment Effect

Biased Electron Cyclotron Resonance Chemical-Vapor Deposition of Silicon Dioxide Inter-Metal Dielectric Thin Films

TEOS-Based Oxides: Deposition Dependent Properties

Plasma Enhanced Chemical Vapor Deposited Silicon and Silicon Dioxide Films for Indium Phosphide MISFET Technology

Physical and Electrical Properties of Silicon Nitride and Oxynitride Films Prepared by Plasma Enhanced CVD

Preparation and Properties of PECVD Silicon Nitride Films from SiH4 + NH3 and/or NF3 and SiF4+ NH3 Gas Mixtures

Bonding Configuration and Defects in Glow-Discharge Amorphous SiNx:H Films Deposited at 300°C and 500°C

Doped Glasses for ULSI-Technology: Integration of Molecular Engineering and Plasma-CVD

Growth Processes and Defect Densities in Hydrogenated Amorphous Silicon Alloys

Sputter Deposition of Thin Films for High Mobility Poly-Si TFT Fabrication

Ion Assisted Thin Film Growth in Dual Microwave/Radio Frequency Plasmas

High Powered Pulsed Plasma Enhanced Deposition of Thin Film Semiconductor and Optical Materials

Plasma-Enhanced Chemical Vapour Deposition of Coatings in the System Ti-B-N

Plasma-Enhanced Metalorganic Chemical Vapor Deposition for High Temperature Superconducting Thin Film

Low Pressure and Low Temperature Synthesis of Diamond Films Using Magneto-Microwave Plasma CVD

Thermal Plasma Chemical Vapor Deposition

Thermally Sprayed Coatings for Electrical and Electronic Applications

ECR Plasma Etching Technology for ULSI

Evaluation of Substrate Degradation in Plasma Etch Processes Using Thermal Wave Analysis

Plasma Etching of Patterned Tungsten

Microwave Plasma Oxidation of Silicon

Hydrogen Interaction with Disordered Silicon

Damage Assessment of Dry Etched III-V Semiconductors for Nanoelectronics

Reactive Ion Beam Etching for Microcavity Surface Emitting Laser Fabrication: Technology and Damage Characterization

Alkane Plasma Etching of Gallium Arsenide

Effects of ECR-Plasma Excitation in GaAs MBE Growth

Plasma Treatment of Polymers for Improved Adhesion Properties

Study of Dry Development in Terms of Resist and Development Method

Author Index

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