Chapter
Part I Fundamental Interactions – Materials Science
1.1 Optical‐Fabrication Processes
1.2 Major Characteristics of the Optical‐Fabrication Process
1.3 Material Removal Mechanisms
2.2 The Preston Coefficient
2.3 Friction at Interface
2.4 Kinematics and Relative Velocity
2.5 Pressure Distribution
2.5.1 Applied Pressure Distribution
2.5.2 Elastic Lap Response
2.5.3 Hydrodynamic Forces
2.5.5 Viscoelastic and Viscoplastic Lap Properties
2.5.6 Workpiece–Lap Mismatch
2.5.6.2 Pad Wear/Deformation
2.5.6.3 Workpiece Bending
2.5.6.4 Residual Grinding Stress
2.5.6.6 Global Pad Properties
2.5.6.7 Slurry Spatial Distribution
2.5.6.8 Local Nonlinear Material Deposits
2.6 Deterministic Surface Figure
Chapter 3 Surface Quality
3.1 Subsurface Mechanical Damage
3.1.1 Indentation Fracture Mechanics
3.1.1.1 Static Indentation
3.1.1.2 Edge Chipping and Bevels
3.1.1.3 Sliding Indentation
3.1.1.4 Impact Indentation Fracture
3.1.2 SSD During Grinding
3.1.2.1 Subsurface Mechanical Depth Distributions
3.1.2.2 Relationship of Roughness and Average Crack Length to the Maximum SSD Depth
3.1.2.3 Fraction of Abrasive Particles Mechanically Loaded
3.1.2.4 Relationship Between the Crack Length and Depth
3.1.2.5 SSD Depth‐distribution Shape
3.1.2.6 Effect of Various Grinding Parameters on SSD Depth Distributions
3.1.2.7 Rogue Particles During Grinding
3.1.2.8 Conclusions on Grinding SSD
3.1.3 SSD During Polishing
3.1.4 Effect of Etching on SSD
3.1.4.1 Topographical Changes of SSD During Etching
3.1.4.2 Influence of SDD Distribution on Etch Rate and Roughness
3.1.5 Strategies to Minimize SSD
3.2 Debris Particles and Residue
3.2.3 Cleaning Strategies and Methods
3.3.1 K Penetration by Two‐step Diffusion
3.3.2 Ce Penetration by Chemical Reactivity
3.3.3 Chemical–Structural–Mechanical Model of the Beilby Layer and Polishing Process
Chapter 4 Surface Roughness
4.1 Single‐Particle Removal Function
4.2 Beilby Layer Properties
4.4 Pad Mechanical Properties and Topography
4.5 Slurry Interface Interactions
4.5.1 Slurry Islands and &rmmu;‐roughness
4.5.2 Colloidal Stability of Particles in Slurry
4.5.3 Glass Reaction Product Buildup at Polishing Interface
4.5.4 Three‐Body Forces at Polishing Interface
4.7.1 EHMG – The Ensemble Hertzian Multi‐gap Model
4.7.1.1 Pad Deflection and Fraction of Pad Area Making Contact
4.7.1.2 Asperity Stress, Interface Gap, Load/Particle Distribution, and Fraction of Active Particles
4.7.1.3 Single Particle Removal Function and Load per Particle Distribution
4.7.1.4 Monte Carlo Workpiece Roughness Simulation
4.7.2 IDG Island‐distribution Gap Model
4.8 Strategies to Reduce Roughness
4.8.1 Strategy 1: Reduce or Narrow the Load‐per‐particle Distribution
4.8.2 Strategy 2: Modify the Removal Function of a Given Slurry
Chapter 5 Material Removal Rate
5.1 Grinding Material Removal Rate
5.2 Polishing Material Removal Rate
5.2.1 Deviations from Macroscopic Preston Equation
5.2.2 Macroscopic Material Removal Trends from Microscopic/Molecular Phenomena
5.2.3 Factors Affecting Single‐particle Removal Function
5.2.3.1 Nanoplastic Effects: Workpiece Hardness
5.2.3.2 Chemical Effects: Condensation Rate and Partial‐charge Model
Part II Applications – Materials Technology
Chapter 6 Increasing Yield: Scratch Forensics and Fractography
6.2.4 Scratch Number Density
6.2.5 Scratch Orientation and Trailing‐indent Curvature
6.2.6 Scratch Pattern and Curvature
6.2.7 Location on Workpiece
6.2.8 Scratch Forensics Example
6.3 Slow Crack Growth and Lifetime Predictions
6.4 Fracture Case Studies
6.4.1 Temperature‐induced Fracture
6.4.1.1 Laser‐Phosphate‐glass Thermal Fracture
6.4.1.2 KDP Crystal‐Workpiece Thermal Fracture
6.4.1.3 Thermal Fracture of Multilayers
6.4.2 Blunt Loading with Friction
6.4.3 Glass‐to‐metal Contact and Edge Chipping
6.4.4 Glue Chipping Fracture
6.4.5 Workpiece Failure from Differential Pressure
6.4.6 Chemical Interactions and Surface Cracking
6.4.6.1 Surface Cracking of Phosphate Glass
6.4.6.2 Surface Cracking of the DKDP Crystals
Chapter 7 Novel Process and Characterization Techniques
7.1.1 Stiff Versus Compliant Blocking
7.1.2 Strip Etch and Bulk Etch
7.1.3 Pad Wear Management with Septum or Conditioner
7.1.4 Hermetically Sealed, High‐humidity Polishing Chamber
7.1.5 Engineered Filtration System
7.1.6 Slurry Chemical Stabilization
7.1.7 Slurry Lifetime and Slurry Recycling
7.1.8 Ultrasonic Pad Cleaning
7.2 Workpiece Characterization Techniques
7.2.1 Single‐particle Removal Function Using Nanoscratching
7.2.2 Subsurface Damage Measurement Using a Taper Wedge
7.2.3 Stress Measurement Using the Twyman Effect
7.2.4 Beilby Layer Characterization Using SIMS
7.2.5 Surface Densification Using Indentation and Annealing
7.2.6 Crack Initiation and Growth Constants Using Static Indentation
7.3 Polishing‐ or Grinding‐system Characterization Techniques
7.3.1 Tail End of Slurry PSD Using SPOS
7.3.2 Pad Topography Using Confocal Microscopy
7.3.3 Slurry Stability Using Zeta Potential
7.3.4 Temperature Distribution During Polishing Using IR Imaging
7.3.5 Slurry Spatial Distribution and Viscoelastic Lap Response Using a Nonrotating Workpiece
7.3.6 Slurry Reactivity Versus Distance Using Different Pad Grooves
Chapter 8 Novel Polishing Methods
8.1 Magnetorheological Finishing (MRF)
8.3 Ion Beam Figuring (IBF)
8.6 Other Subaperture Polishing Methods
Chapter 9 Laser Damage Resistant Optics
9.1 Laser Damage Precursors
9.2 Reduction of SSD in Laser Optics
9.3 Advanced Mitigation Process
Materials Science and Technology of Optical Fabrication
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