Description

There is an increasing demand for efficient cooling techniques in computer industry to dissipate the associated heat from the newly designed and developed computer processors to accommodate for their enhanced processing power and faster operations. Such a demand necessitates researchers to explore efficient approaches for central processing unit (CPU) cooling. Consequently, heat pipes can be a viable and promising solution for this challenge. In this chapter, a CPU thermal design power (TDP), cooling methods of electronic equipments, heat pipe theory and operation, heat pipes components, such as the wall material, the wick structure, and the working fluid, are presented. Moreover, we review experimentally, analytically and numerically the types of heat pipes with their applications for electronic cooling in general and the computer cooling in particular. Summary tables that compare the content, methodology, and types of heat pipes are presented. Due to the numerous advantages of the heat pipe in electronic cooling, this chapter definitely leads to further research in computer cooling applications.

Chapter