Simulation of Dynamic Recrystallization in Solder Interconnections During Thermal Cycling
( Recent Developments in the Study of Recrystallization )
Publication series ： Recent Developments in the Study of Recrystallization
Author： Jue Li Tomi Laurila Toni T. Mattila Hongbo Xu and Mervi Paulasto- Kröcke
Publisher： IntechOpen
Publication year： 2013
E-ISBN: INT5603153820
P-ISBN(Paperback): 9789535109624
P-ISBN(Hardback): 9789535109624
Subject： O414 Thermodynamics and Statistical Physics;TH Machinery and Instrument Industry
Keyword： Energy technology & engineering,热力学与统计物理学
Language： ENG
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Simulation of Dynamic Recrystallization in Solder Interconnections During Thermal Cycling