Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method

Author: Huh Seok-Hwan   Kim Kang-Dong   Kim Keun-Soo  

Publisher: Emerald Group Publishing Ltd

ISSN: 0305-6120

Source: Circuit World, Vol.40, Iss.2, 2014-04, pp. : 71-78

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