The role of microstructure in the electrical and thermal conductivity of Ni-alloys for LIGA microsystems

Author： Graham S.   Kelley J.   Yang N.   Borca-Tasciuc T.  

Publisher： Springer Publishing Company

ISSN： 0946-7076

Source： Microsystem Technologies, Vol.10, Iss.6-7, 2004-10, pp. : 510-516

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