Electrochemical nucleation and growth of copper on HOPG in presence of PEG and chloride ions as additives

Author： Huang L.   Yang F.-Z.   Xu S.-K.   Zhou S.-M.  

Publisher： Maney Publishing

ISSN： 0020-2967

Source： Transactions of the Institute of Metal Finishing, Vol.84, Iss.1, 2006-01, pp. : 47-51

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