Electrodeposition of Cu from acidic sulphate solutions in presence of Bis-(3-sulphopropyl)-disulphide (SPS)

Author: Bozzini B.   D'Urzo L.   Mele C.   Romanello V.  

Publisher: Maney Publishing

ISSN: 0020-2967

Source: Transactions of the Institute of Metal Finishing, Vol.84, Iss.2, 2006-03, pp. : 83-93

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