Related content

Influence of organic additives on electrodeposition of Co-Cu alloys from sulphate bath

By Mentar L   Khelladi M R   Azizi A   Kahoul A  

Transactions of the Institute of Metal Finishing, Vol. 90, Iss. 2, 2012-03 ,pp. : 98-104

Maney Publishing

Access to resources Recommend Favorite

Pulse and pulse reverse plating of copper from acid sulphate solutions

By Leisner P.   Fredenberg M.   Belov I.  

Transactions of the Institute of Metal Finishing, Vol. 88, Iss. 5, 2010-09 ,pp. : 243-247

Maney Publishing

Access to resources Recommend Favorite

Stress-Strain Hysteresis and Damping in MnCu and NiTi Alloys

By De Santis S.   Trochu F.   Ostiguy G.  

Metallurgical and Materials Transactions A, Vol. 32, Iss. 10, 2001-10 ,pp. : 2489-2498

Springer Publishing Company

Access to resources Recommend Favorite

Electrodeposition of Zn–Cu coatings from alkaline sulphate bath containing glycine

By Rashwan S. M.  

Transactions of the Institute of Metal Finishing, Vol. 85, Iss. 4, 2007-07 ,pp. : 217-224

Maney Publishing

Access to resources Recommend Favorite

Pulse plating of Ni–W alloys from model electrolytes

By Franz S.   Marlot A.   Cavallotti P. L.   Landolt D.  

Transactions of the Institute of Metal Finishing, Vol. 86, Iss. 2, 2008-03 ,pp. : 92-97

Maney Publishing

Access to resources Recommend Favorite