Effect of triethanolamine on deposition rate of electroless copper plating

Author: Jiang H. Y.   Liu Z. J.   Wang X. W.   Wang Z. L.  

Publisher: Maney Publishing

ISSN: 0020-2967

Source: Transactions of the Institute of Metal Finishing, Vol.85, Iss.2, 2007-03, pp. : 103-106

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