Electroless gold plating from tetrachloroaurate solutions containing hexacyanoferrate(II) ions

Author： Vrublevskaya O. N.   Vorobyova T. N.   Lee H.-K.   Koo S.-B.  

Publisher： Maney Publishing

ISSN： 0020-2967

Source： Transactions of the Institute of Metal Finishing, Vol.85, Iss.5, 2007-09, pp. : 254-259

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Tin plating in acid Sn(II) gluconate solutions containing excess of sulphate

By Survila A   Mockus Z   Kanapeckaitė S   Stalnionis G   Juškėnas R  

Transactions of the Institute of Metal Finishing, Vol. 91, Iss. 4, 2013-07 ,pp. : 197-201

Maney Publishing

Access to resources Recommend Favorite

The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating

By Zeng Kejun   Stierman Roger   Abbott Don   Murtuza Masood  

JOM, Vol. 58, Iss. 6, 2006-06 ,pp. : 75-79

Springer Publishing Company

Access to resources Recommend Favorite

Removal of Cu(II) Ions from Aqueous Solutions by Adsorption onto Natural Bentonites

By  

Solid State Phenomena, Vol. 2015, Iss. 244, 2016-02 ,pp. : 205-9

Trans Tech Publications

Access to resources Recommend Favorite

Pulse and pulse reverse plating of copper from acid sulphate solutions

By Leisner P.   Fredenberg M.   Belov I.  

Transactions of the Institute of Metal Finishing, Vol. 88, Iss. 5, 2010-09 ,pp. : 243-247

Maney Publishing

Access to resources Recommend Favorite

ELECTROLESS NICKEL BORON PLATING ON AA6061

By DADVAND N.   KIPOUROS G.J.   CALEY W.F.  

Canadian Metallurgical Quarterly, Vol. 42, Iss. 3, 2003-01 ,pp. : 349-364

Maney Publishing

Access to resources Recommend Favorite