Improvement of Elastic Modulus and Thermal Stability of Epoxy Resin Using New Curing Agents

Author： Kirithick R.   Lakshmipati U. S.   Ambarish M.   Maharaaj K. Vignesh  

Publisher： Taylor & Francis Ltd

ISSN： 0360-2559

Source： Polymer-Plastics Technology and Engineering, Vol.53, Iss.5, 2014-03, pp. : 497-503

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Kinetics of Curing and Thermal Degradation of POSS Epoxy Resin/DDS System

By Gao Jungang   Jiang Chaojie   Zhang Xuejian  

International Journal of Polymeric Materials, Vol. 56, Iss. 1, 2007-01 ,pp. : 65-77

Taylor & Francis Ltd

Access to resources Recommend Favorite

Curing Behavior, Kinetics and Thermal Properties of o-Cresol Formaldehyde Epoxy Resin Modified by Liquid Crystalline Epoxy Resin

By Gao Jungang   Zhang Xiaona   Huo Li  

International Journal of Polymeric Materials, Vol. 57, Iss. 10, 2008-10 ,pp. : 925-939

Taylor & Francis Ltd

Access to resources Recommend Favorite

Synthesis of rosin-based imidoamine-type curing agents and curing behavior with epoxy resin

By Wang Honghua   Wang Haiwei   Zhou Guangyuan  

Polymer International, Vol. 60, Iss. 4, 2011-04 ,pp. : 557-563

John Wiley & Sons Inc

Access to resources Recommend Favorite

Novel Piperazinylo Bisaryl Hydrazino-S-Triazine Derivatives and Their Application as Epoxy Resin Curing Agents

By Chaudhari J. A.  

International Journal of Polymeric Materials, Vol. 58, Iss. 8, 2009-08 ,pp. : 401-408

Taylor & Francis Ltd

Access to resources Recommend Favorite

Low temperature epoxy curing agents

By  

Focus on Powder Coatings, Vol. 2003, Iss. 3, 2003-03 ,pp. : 3-4

Elsevier

Access to resources Recommend Favorite