Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
( Woodhead Publishing Series in Electronic and Optical Materials )
Publication series ：Woodhead Publishing Series in Electronic and Optical Materials
Publisher： Elsevier Science
Publication year： 2015
E-ISBN: 9780857099112
P-ISBN(Paperback): 9781845695286
Subject： TN05 Manufacturing process and equipment
Keyword： 无线电电子学、电信技术
Language： ENG
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Description
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.
The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.
The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
- Discusses how the reliability of packaging components is a prime concern to electronics manufacturers
- Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques
- Includes program files and macros for additional study