Recent advances in mechanical properties of anisotropic conductive adhesive film for microelectronic packaging

Author: GaoLilanTianjin Key Laboratory of the Design and Intelligent Control of the Advanced Mechatronical System   Tianjin University of Technology   Tianjin   PR China   GaoHongSchool of Chemical Engineering and Technology   Tianjin University   Tianjin   PR China   ChenXuSchool of Chemical Engineering and Technology   Tianjin University   Tianjin   PR China  

Publisher: Emerald Group Publishing Ltd

E-ISSN: 1758-6836|27|4|164-177

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.27, Iss.4, 2015-09, pp. : 164-177

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