Bonding of zero-shrink LTCC with alumina ceramics

Author: SomerJakubDepartment of Microelectronics   Brno University of Technology   FEEC   Brno   Czech Republic   ŠtekovičMichalDepartment of Microelectronics   Brno University of Technology   FEEC   Brno   Czech Republic   UrbanFrantišekDepartment of Microelectronics   Brno University of Technology   FEEC   Brno   Czech Republic   ŠanderaJosefDepartment of Microelectronics   Brno University of Technology   FEEC   Brno   Czech Republic   SzendiuchIvanDepartment of Microelectronics   Brno University of Technology   FEEC   Brno   Czech Republic  

Publisher: Emerald Group Publishing Ltd

E-ISSN: 1758-6836|27|4|157-163

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.27, Iss.4, 2015-09, pp. : 157-163

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Abstract