Author: SomerJakubDepartment of Microelectronics Brno University of Technology FEEC Brno Czech Republic ŠtekovičMichalDepartment of Microelectronics Brno University of Technology FEEC Brno Czech Republic UrbanFrantišekDepartment of Microelectronics Brno University of Technology FEEC Brno Czech Republic ŠanderaJosefDepartment of Microelectronics Brno University of Technology FEEC Brno Czech Republic SzendiuchIvanDepartment of Microelectronics Brno University of Technology FEEC Brno Czech Republic
Publisher: Emerald Group Publishing Ltd
E-ISSN: 1758-6836|27|4|157-163
ISSN: 0954-0911
Source: Soldering & Surface Mount Technology, Vol.27, Iss.4, 2015-09, pp. : 157-163
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Abstract
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