Simultaneous Measurement of In-Plane and Out-of-Plane Deformations Using Dual-Beam Spatial-Carrier Digital Speckle Pattern Interferometry
Publisher: Trans Tech Publications
E-ISSN: 1662-7482|2015|782|316-325
ISSN: 1660-9336
Source: Applied Mechanics and Materials, Vol.2015, Iss.782, 2015-09, pp. : 316-325
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Abstract