Formation of Kirkendall Voids at Low and High Aging Temperature in the Sn-0.7Cu-1.0wt.%Si₃N₄/Cu Solder Joints

E-ISSN： 1662-8985|2015|1107|577-581

ISSN： 1022-6680

Source： Advanced Materials Research, Vol.2015, Iss.1107, 2015-07, pp. : 577-581

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