Publisher： Trans Tech Publications
E-ISSN： 1662-9795|2015|643|193-197
ISSN： 1013-9826
Source： Key Engineering Materials, Vol.2015, Iss.643, 2015-06, pp. : 193-197
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
By Tolmachev A. Anuchin K. Kryuchenkova N. Fomkin A.
Protection of Metals and Physical Chemistry of Surfaces, Vol. 47, Iss. 2, 2011-03 ,pp. :
Access to resources
Recommend
Access to resources
Modelling of Industrial Processes Using Computational Fluid Dynamics
Canadian Metallurgical Quarterly, Vol. 37, Iss. 3-4, 1998-10 ,pp. :
A molecular dynamics study of void interaction in copper
IOP Conference Series: Materials Science and Engineering, Vol. 10, Iss. 1, 2010-06 ,pp. :
Computational Analysis of the Interaction between Impregnation, Forming and Curing in Pultrusion
Key Engineering Materials, Vol. 2015, Iss. 651, 2015-08 ,pp. :