Publisher: Trans Tech Publications
E-ISSN: 1662-9795|2015|645|1320-1325
ISSN: 1013-9826
Source: Key Engineering Materials, Vol.2015, Iss.645, 2015-06, pp. : 1320-1325
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Optimization of Microfluidic Chip Bonding Technology Based on Polydimethylsiloxane
Key Engineering Materials, Vol. 2015, Iss. 645, 2015-06 ,pp. :
Flow Field Analysis for Plant Vessel and Bionic Structural Microfluidic Chip
Key Engineering Materials, Vol. 2015, Iss. 645, 2015-06 ,pp. :
Threshold Model of Micro-Fluidic Inertial Switch Based on Orthogonal Regression Design
Key Engineering Materials, Vol. 2015, Iss. 645, 2015-06 ,pp. :
Multi-Chip Module Design of a MEMS Air Pressure Sensor
Key Engineering Materials, Vol. 2015, Iss. 645, 2015-06 ,pp. :