Publisher: Trans Tech Publications
E-ISSN: 1662-9795|2015|645|986-989
ISSN: 1013-9826
Source: Key Engineering Materials, Vol.2015, Iss.645, 2015-06, pp. : 986-989
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
The Buckling Simulation of Planar W-Form Micro-Spring in MEMS Safety and Arming Device
Key Engineering Materials, Vol. 2015, Iss. 645, 2015-06 ,pp. :
Analysis on the Effect of Machining Error on the Vibration of MEMS Device
Key Engineering Materials, Vol. 2015, Iss. 645, 2015-06 ,pp. :
Simulation and Typical Application of Multi-Step Diffusion Method for MEMS Device Layers
Key Engineering Materials, Vol. 2015, Iss. 645, 2015-06 ,pp. :