The Effect of Micron-Size Silicon Additions on Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni Solder Alloy

Publisher： Trans Tech Publications

E-ISSN： 1662-9752|2015|819|161-166

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2015, Iss.819, 2015-07, pp. : 161-166

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