Electrochemical Impedance Spectroscopy as a Prospective Tool for the Characterization of the Intermetallic Microstructure of Lead Free Solder

Publisher： Trans Tech Publications

E-ISSN： 1662-9752|2015|812|333-338

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2015, Iss.812, 2015-03, pp. : 333-338

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Abstract

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