Effects of Cu Contamination on the Electrical Properties of Multicrystalline Silicon Purified by Directional Solidification Route

Publisher: Trans Tech Publications

E-ISSN: 1662-9752|2014|809|846-851

ISSN: 0255-5476

Source: Materials Science Forum, Vol.2014, Iss.809, 2015-02, pp. : 846-851

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Abstract